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Chapter 1 · CMM III

Hardware

The following figure shows a block diagram of CMM_III and its external connections:

Block diagram: test system with system power supply (5...24V) and data acquisition (CAN, LVDS-SPI), CMM_III with measurement control and range resistors R0 to R6, RS232 service/configuration interface, isolation barrier <150V, DUT supply and DUT
Figure 1: CMM_III HW Overview

General setup:

  • CMM_III needs 5…24V power supply on PWR/GND_Ext
  • The CMM_III Current Path is integrated in series to the DUT, whose current should be monitored.

The measurement values can be read out by the following:

  • Digital output via a 32-bit SPI word at LVDS voltage level.
  • CAN (High-Speed-CAN with 250…1000 Kbit/s)
  • RS232 as ASCII-String via the service interface

Additional features are:

  • The RS232 service interface may be also used to configure the module.
  • Permanent parameter storage of the configuration in Flash memory
  • Calculation of mean, min and max values.
  • Current path is electrically isolated from electronics supply and digital IO (up to 150V)
  • Detection of reverse current
  • Front panel LEDs for power good indication (as of hardware revision 2.0)

1.1Connector Pinning

1.1.1System connector

InterfaceSignalPinRecommended wireRemarks
Module PowerPWR_ExtC130,14 … 0,5mm²
Module PowerGND_ExtA13, A14, A16, A17, A18, A19, A200,14 … 0,5mm²Connect at least 1 pin
On/OffOn/OffA150,14 … 0,5mm²
CANCAN_LB140,14 … 0,5mm² Twisted pairWire with ~ 120 Ohm impedance
CANCAN_HC140,14 … 0,5mm² Twisted pairWire with ~ 120 Ohm impedance
LVDS-SPICLK_In+B150,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPICLK_In-C150,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPIEn_In+B160,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPIEn_In-C160,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPIRx+B170,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPIRx-C170,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPITx+B180,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPITx-C180,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPIEn_In+B190,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPIEn_In-C190,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPICLK_Out+B200,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
LVDS-SPICLK_Out-C200,14 … 0,5mm² Twisted pairWire with ~ 100 Ohm impedance
Current PathCurr_In4x High current pin A1-A12, B1-B12, C1-C121…4 x 10mm²Depending on applied currents use 1 to 4 wires with appropriate diameter for both input and output, respectively. For currents above 60A use all 4 pins both for input and output.
Current PathCurr_Out4x High current pin A21-A32, B21-B32, C21-C321…4 x 10mm²Depending on applied currents use 1 to 4 wires with appropriate diameter for both input and output, respectively. For currents above 60A use all 4 pins both for input and output.

1.1.2RS232 service connector

InterfaceSignalPinRecommended wireRemarks
RS232CMM_Tx2Standard 9pol. 1:1 cableSend data to PC
RS232CMM_Rx3Standard 9pol. 1:1 cableReceive data from PC
RS232GND5Standard 9pol. 1:1 cableGND connected to GND_Ext

Note, that the RS232 is a service connection. Normal operation uses the system connector with CAN or LVDS-SPI interface.

1.1.3Mating system connector

The following components may be used for the mating connector on the test system. 1 connector with 8 high current pins is needed. Different versions for crimping or soldering from two manufacturers can be found in the following table.

ItemQuantityOrder NumberManufacturerRemarks
DIN41612 Type M 24+8109 03 224 6804Harting
DIN41612 Type M 24+81354 116ERNI
High current pin809 03 000 6115HartingCrimp version
High current pin809 03 000 6103HartingSolder version
High current pin8594 182ERNICrimp version
High current pin8594 176ERNISolder version

1.2Dimensions

CMM_III is designed on a 160mm x 100mm Euro card, including front cover with a width of 25,4mm (5HP) and a standard DIN41612 connector. With these dimensions it fits to standard 19” / 3HU carriers and racks.

CMM III module with front panel, dimensions 130mm (3HU) front panel height, 100mm board height, 160mm board length, 25,4mm (5HP) front panel width
Figure 2: CMM_III Dimensions

1.3Technical data

1.3.1Current Path

Depending on the applied currents, the measurement current path must be wired with a low resistance to maintain low voltage drops. I.e., use short wires and as much high-current-pins as possible – both for current input and current output.

Every High-Current pin may carry up to 40A DC maximum. But more used high current pins with wires of high diameter both yield lower voltage drops and temperature at CMM_III, because of heat conduction. Lower temperature also means lower drift.

ItemMinTypMaxUnitsRemarks
DC Current0100Aoperation under the following conditions: 25°C ambient temperature without airflow; 50° Ambient Temperature with airflow ~2m/s
Worst case DC Current160A25° Ambient Temperature with airflow >6m/s on power devices and connector
DC Current per High-current pin40A50° Ambient Temperature
Measurement Range190AMax. 3 seconds
Single Pulse Current300AMax. 100ms
CMM_III Voltage @ OFF HW-Rev 1.236VModule disconnects current path when PWR_Ext is below 4,8V, or ON/Off is at low level. For HW-Rev 1.1 max. Voltage is 30V!
Leakage current @ OFF020µA@ 36V
Voltage difference between GND_Ext and Current Path-150150VLimit is restricted by distance of wiring on the PCB. Electronic components are specified at least 250V
Reverse Current detection threshold501000mADepending on Temperature and components
Reverse Current continuous030A
Reverse Current single pulse200AMax. 1 second.

1.3.2Current Sampling

ItemMinTypMaxUnitsRemarks
Sample Rate (fS)41,667kHzExternal sample rate
Internal Sample Rate (fS_INT)375kHz9 internal samples form an external sample
Range Changed Ignored Samples Count (Dead Time) (Configurable by command RCISC)66255SamplesSince firmware 2.2.0. Default after boot: 6 samples (Note: The range may change (rise) during this time if the dropout voltage rises too high. This will reset the dead time timer!)

1.3.3Module Supply

Apply a power source on PWR_Ext/GND_Ext. It is recommended not to use the DUT power supply to make sure that measurement device power is separate from DUT power. Typical applications use 5V, 12V or 24V power supplies. Several other components may be supplied by the same power source.

Nonetheless, because of CMM_III wide input voltage range, it is possible to use DUT-Power for powering CMM_III.

Note, that current path is disconnected, when no power is applied.

ItemMinTypMaxUnitsRemarks
Supply Voltage4,926VPWR_Ext to GND_Ext
Supply DC Current @ 5V190210250mA
Supply DC Current @ 12V8092120mA
Supply DC Current @ 24V405170mA
Supply Inrush Current1,21,5AInrush current for approx. 5ms @ dU/dt = 1V/ms

1.3.4DC Accuracy

Accuracy of the module is verified at DC currents. Every module passes a calibration procedure at IRS. The module may be re-calibrated.

ItemMinTypMaxUnitsRemarks
Accuracy uncalibrated0,52% of RangeMax in % of respective Range
Accuracy calibrated0,21% of RangeMax in % of respective Range
Resolution Range_0100nALimited by output data step size.
Resolution Range_1404nA
Resolution Range_24,04µA
Resolution Range_340,3µA
Resolution Range_4403µA
Resolution Range_54,03mA
Resolution Range_646,8mA

1.3.5DC Voltage Drop

Voltage drop is the voltage between current input and output, measured on the module connector. The drop on the female power connector pins and the wiring must be added.

ItemMinTypMaxUnitsRemarks
Drop @ 100µA7080mVRange_0
Drop @ 1mA7080mVRange_1
Drop @ 10mA7080mVRange_2
Drop @ 100mA7080mVRange_3
Drop @ 1A90100mVRange_4
Drop @ 10A100120mVRange_5
Drop @ 40A4560mVRange_6
Drop @ 100A120150mVRange_6
Drop @ 160A200230mVRange_6

1.3.6On/Off Interface

The digital input On/Off is used to switch the current path of the CMM_III on or off.

The current path is connected, when a high level is applied.

The current path is open, when a low level is applied.

ItemMinTypMaxUnitsRemarks
On/Off Control – Low = OFF-0,71,0V
On/Off Control – High = ON3.025V
On/Off Control Input Resistance15kOhm0…3,3V
On/Off Control Input Resistance515kOhm3,3…25V

1.3.7CAN Interface

The integrated CAN interface is a common High-Speed CAN interface.

ItemMinTypMaxUnitsRemarks
Voltage at CAN_H or CAN_L-0,55,5VAgainst GND_Ext
Input range, transient pulse CAN_H and CAN_L-2525V
Dominant output level1,223V
Recessive output level-120012mV
Data rate1000kbit/s

For further details, see datasheet SN65HVD230 and CAN.

1.3.8LVDS-SPI Interface

ItemMinTypMaxUnitsRemarks
Voltage Range-0,22,7VLVDS-SPI inputs
Termination100OhmLVDS-SPI inputs
Differential input voltage range100350600mVLVDS-SPI inputs
Common mode input voltage range0.31.22.2VLVDS-SPI inputs
Differential output voltage range247350600mVLVDS output
Common mode output voltage range1.1251.251.375VLVDS output
LVDS Interface Baudrate (typical no feedback)50012501500kBit/sWithout Clock feedback
LVDS Interface Baudrate (maximum with feedback)15000MBit/sWith Clock feedback to system

For further details, see datasheet DS90LV049 and LVDS-SPI.

1.4System Integration

The following section handles the hardware issues about the interfaces for accessing measurement data. For integration of the current path and the power supply, see the remarks in the technical data.

1.4.1CAN

The High-speed CAN interface may be used to read measurement data.

Any High-Speed CAN interface from any vendor may be applied as counterpart for data acquisition. Make sure that termination of the entire bus is implemented properly with two times 120 Ohm at the respective far end of the bus. No other termination resistors are included.

Wires must be twisted pair with an impedance of 120 Ohm.

Every CMM on the bus should run at the same baud rate and use different CAN IDs. CAN ID and baud rate may be configured via the RS232 service interface and are stored permanently in Flash memory.

For integration as a single module in a test system setup, please add a CAN counterpart with a termination resistor of 120 Ohm. CMM_III includes 120 Ohm -termination which can be enabled or disabled by a jumper switch (see figure 3).

If several CMM_III are connected in parallel to one CAN interface, the termination resistor of every single CMM_III has to be disabled. A single termination must be included at the far end of the CAN bus.

See the following figure for disabling of the termination resistor with the jumper switch J3, which is marked in red:

CMM III board with jumper J3 for CAN termination marked by a red circle, arrows Disable (left) and Enable Termination (right)
Figure 3: CAN Termination Resistor

See also CAN Backplane, when using backplane and CAN interface.

1.4.2LVDS-SPI

Implementation Options

LVDS-SPI is integrated to read data from CMM at a higher data rate, than available via CAN. But LVDS SPI may not be used in a harsh test system environment.

For a single module, the following setup may be used. Note, that every signal in the diagram is actually a differential pair. With this setup data rates of approximately 1,5Mbit/s can be achieved. With this speed a sample rate of up to 20kS/s can be achieved for a single module.

Data acquisition connected to CMM_III: Clock to Clk_In, Enable to En_In, Data from Tx
Figure 4: LVDS-SPI for a single module at data rates up to 1,5Mbit/s

When higher data rates than 1,5Mbit/s are applied, the enable and clock line must be fed back to the data acquisition system. With this setup, Data, clock-feedback and enable-feedback may be evaluated synchronously. Otherwise, the delay through the CMM may cause corrupt data.

Data acquisition connected to CMM_III: Clock and Enable in, Data from Tx, Enable_Feedback from En_Out and Clock_Feedback from Clk_Out
Figure 5: LVDS-SPI for a single module at data rates up to 15Mbit/s

The LVDS-SPI interface is designed in a way to concatenate several CMM’s in a daisy chain type, as illustrated in the following figure.

Three CMM_III in a daisy chain: Clk_Out, En_Out and Tx of each module connected to Clk_In, En_In and Rx of the next, Data and optional Enable_Feedback and Clock_Feedback back to the data acquisition
Figure 6: LVDS-SPI “Daisy chain” for several modules

The maximum number of CMMs depends on data rate, sampling rate and performance of the data acquisition system. Typical setups are as follows:

Typical setup 1:

  • 1…10 CMMs
  • sampling rate of 2,5kS/s.
  • clock rate of 1,25Mbit/s
  • feedback of clock and enable not necessary

Typical setup 2:

  • 1…10 CMMs
  • Sampling rate of 20kS/s
  • clock rate of 10Mbit/s
  • Feedback of clock and enable necessary.

Please note, that in any case, the wires for clock, enable, Rx and Tx must be at least properly twisted with a maximum length of approx. 1m. When higher distances must be covered, please use the backplane, described in Backplane for easy connection, including shielded CAT5…CAT7 cables. In harsh environments, always use the backplane.

Data Acquisition with IRS MesSy

The standard device for data acquisition is the IRS MesSy. MesSy is a generic re-usable multifunction measurement device, especially designed for lifetime test of automotive control units.

All software components are integrated ready to use a single CMM or several CMMs in daisy-chain. Evaluation of minimum, maximum and average is included. Streaming of CMM data is available.

For further information see

https://www.irs.systems/id/irs-messy/

https://www.irs.systems/de/id/irs-messy/ (German)

The following table shows the connections of MesSy and CMM:

MesSy signalMesSy Pin @ X1CMM_II SignalCMM_III PinwireRemarks
LVDS_Out_3+B16Rx+B17Twisted pairFirst CMM in chain
LVDS_Out_3-C16Rx-C17Twisted pairFirst CMM in chain
LVDS_Out_2+B15En_In+B16Twisted pairFirst CMM in chain
LVDS_Out_2-C15En_In-C16Twisted pairFirst CMM in chain
LVDS_Out_1+B14Clk_In+B15Twisted pairFirst CMM in chain
LVDS_Out_1-C14Clk_In-C15Twisted pairFirst CMM in chain
LVDS_In_1+C12Tx+B18Twisted pairTx from the CMM, which is the last in chain
LVDS_In_1-B12Tx-C18Twisted pairTx from the CMM, which is the last in chain
Trigger 1…16A7-A12, B7-B11, C7-C11On/OffB15Single wireUse any of the 16 Trigger lines from MesSy

Following example shows the connection of the communication lines, power and On/Off-control of two CMMs:

Wiring diagram: IRS MesSy X1 connected to CMMII_DUT1 and CMMII_DUT2 via VG_24+8 connectors, LVDS lines, power +24V/0V and On/Off control
Figure 7: MesSy connections

Data Acquisition with NI Compact RIO

For data acquisition IRS provides interface modules for the Compact-RIO platform from National Instruments. The software may be integrated into the user’s application. For data acquisition with Compact-RIO please contact IRS.

Custom Data Acquisition

Any module with an SPI-interface may be used for data acquisition, like microcontroller devices. The level of each signal must meet the LVDS standard to maintain proper communication over long wires in harsh environments.

See LVDS-SPI data output for timing and data format of the communication.

1.4.3Backplane for easy connection

To access the interfaces with an easy wiring, the use of the additional backplane is recommended. Especially when using LVDS-SPI, standard cables may be applied, which reduce the efforts for wiring and provide proper shielding.

Three backplanes are available:

  • LVDS-SPI / 5HP width (25,4mm)
  • CAN / 5HP width (25,4mm)
  • LVDS+CAN / 8HP width (40,64mm)

LVDS-SPI Backplane

LVDS-SPI backplane may be used, when no CAN interface is necessary and many CMMs must be integrated on small room. The backplane enables easy connection of the LVDS-SPI interface with standard CAT5…CAT7 cables, while providing proper shielding

LVDS-SPI backplane: photo and drawing with On/Off input, optional PE for shield, 5…24V power input, LVDS interface to test system or previous CMM (K4), jumpers to set at last CMM in the chain, LVDS interface to next CMM (K1), shield pad to connect to housing

Following figure illustrates the options, how to pass data back to the data acquisition system. First option is used for clock rates up to 1,5Mbit/s, second option needs the clock and enable feedback for higher data rates.

Two chains of three CMM_III on backplanes connected via K4 Prev and K1 Next: first with jumper closed at the last backplane, second with jumper opened and Data and Feedback cable back to the data acquisition
Figure 8: LVDS-SPI backplane options

CAN Backplane

CAN Backplane may be used, when no LVDS-SPI interface is necessary and many CMMs must be integrated on small room.

CAN backplane with D-Sub connector (7: CAN_H, 2: CAN_L, 5: GND), 5…24V power input and On/Off input
Figure 9: CAN backplane options

LVDS+CAN Backplane

LVDS-SPI and CAN may be both accessed, with the drawback that more room must be reserved for the connectors.

LVDS+CAN backplane with D-Sub connector, two RJ45 connectors and power/On/Off terminal
Figure 10: LVDS-SPI + CAN backplane

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