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Documentation · MesSy

MesSy

This document describes and specifies the IRS measurement system for lifetime-testers, based on National Instruments’ Single-Board-RIO.

The measurement system includes analog voltage measurement modules, digital output and relay modules, CAN and serial communication modules. The purpose of the measurement system is the application in lifetime testers, especially for automotive control units.

In the following chapters the hardware of the measurement system is described both in general and for every functional module respectively. Additionally the software architecture and the API for accessing the hardware are explained.

Applicable documents

Nr.DocumentDateRemark
1CurrentConverter_8x_Datasheet_V1.0.pdf04.02.2013
2LDSA_MesSy_Guide_HW_V_1_1.docx05.02.2013

Table 3: Applicable documents

Abbreviations

AbbreviationDescriptionRemarks
LDSALebensDauerSimulationsAnlageGerman word for life time tester
DUTDevice Under Test
UPSUninterruptable Power Supply
GUIGeneric User Interface
MesSyMeasurement System
APIApplication Programmer’s Interface
TSCTestStand ControllerSoftware for running test procedure in TestStand
COTSComponent Off-The-ShelfStandard component
FPGAField Programmable Gate ArrayProgrammable logic device
RTReal TimeSoftware Part in the MesSy
GNDGroundVoltage potential of 0V

Table 4: Abbreviations

Chapter 1

HW Description

1.1Block Diagram

Block diagram of the measurement system: PC via Ethernet to sbRIO (RT controller and FPGA), headers P2–P5 to the analog input, digital output and misc boards with connectors X1–X6, optional C-Series modules J9–J11 on X2, 24V-DC supply

The Measurement system contains the following:

  • NI Single-board-RIO sbRIO-9602 (COTS from National Instruments) including
    • Processor with real-time Software (LabVIEW RT)
    • FPGA for accessing other boards via digital IO and data processing (LabVIEW FPGA)
  • 128x Analog inputs with the following configuration twice:
    • 32 channels single ended (0…32V / 14Bit)
      • 3kS/s parallel / 1,2MS/s single channel
      • referenced to a GND node
    • 16 channels single ended (0…32V / 14Bit )
      • 6kS/s parallel / 1,2MS/s single channel
      • referenced to an additional GND node
    • 16 channels differential (+-48V / 14 Bit )
      • 150kS/s parallel / 1,2MS/s single channel
  • 88x digital outputs with the following configuration twice:
    • 24 relays shutters
    • 8 relays changeover
    • 10 FET outputs referenced to system GND
    • 2 FET outputs isolated for any reference GND
  • 4x CAN
    • 2x high speed with selectable termination resistor (None, 120 Ohm, 60 Ohm)
    • 2x without transceiver to implement DUT specific Transceiver in the load-box for high speed, low speed, or special CAN (e.g. E-CAN for trucks)
  • 10x serial
    • without transceiver to implement DUT specific Transceiver in the load-box for K-Line, LIN, …
  • LVDS interface (3x Out, 2x In) for up to 6 cascaded current measurement modules
  • 16x open collector output for controlling status LEDs or general purpose output
  • 6x digital input for high speed digital signal capturing
  • 16x digital IO for low speed digital signal capturing or generation

1.2Power Supply

The Measurement system needs a single 24V DC supply at a current consumption of approx. 700mA in average, 1500mA maximum.

1.3Internal Interfaces

In the standard configuration the measurement system consists of an aluminium carrier which contains 4 printed circuit boards. These are:

  • NI Single board RIO board sbRIO-9602 (COTS from National Instruments)
  • Base and communication–board (board developed by IRS)
  • Digital output board (board developed by IRS)
  • Analogue Input board (board developed by IRS)

The following figure illustrates the 4 boards inside the measurement system

Exploded view of the boards inside the measurement system: base board with Ethernet, analog input boards (64x Analog In), digital boards (24x Relay NO, 8x Relay NO/NC, 12x open Drain) and CAN/LIN, CMM, LED and trigger counterparts

The boards are connected with ribbon cables to the headers P2, P3, P4, and P5 of the sbRIO device. Additionally up to three Compact-RIO c-Series modules can be attached according to the following picture.

For accessing the c-Series external signals the c-Series signals can be routed to a spare 96 pol. connector (DIN41612) on the base and communication board.

Three standard C-Series modules attached next to the sbRIO headers P4 (0,1,2), P2 (2,5,6), P5 (3,4,7) and P3 (7,8,9)

1.4External Interfaces

All external connections to the DUT and the load-box are established via 6x 96pol. VG connectors (DIN41612). I.e. the carrier can be plugged into the load-box without any other cabling. The connection for communication with the PC is the only additional cable, which is actually a common Ethernet connection with a standard Ethernet cable.

Measurement system carrier: rear side with 6x VG96 connector DIN41612, front panel with Ethernet connector

The following block diagram shows a typical setup of the measurement system within a lifetime tester, where additional signal conditioning can be applied for non-standard voltage ranges, load current measurements, analogue outputs, and communication transceivers.

Typical setup in a loadbox: measurement system software, micro-controller, CAN, serial, digital out, analog in and LVDS; optional external hardware such as cRIO module, external transceivers, analog out, digital and analog conditioning and CMM supply current measurement; DUT loads and DUT

1.5Load box design

The following figure illustrates the typical placement of the measurement system inside the load box from the side view:

Side view of the load box: load cards / heat sinks at the front, connectors and wiring, measurement system (230 mm) at the back

In the typical application of the measurement system the artificial and original loads of the DUT are placed in the front area of the load-box, mounted on heat sinks or other load cards. At the backside the measurement system should be placed with additional electronics like current measurement module, and the connectors to DUT and power supply.

The following figure illustrates the typical placement of the measurement system inside the load box from the top view:

Top view of the load box: load cards / heat sinks, power supply +24V DC, additional electronics, current measurement module (CMM), measurement system 21TE (106,68mm), DUT connectors and power input

The following figure illustrates the typical placement of the measurement system inside the load box from the top view:

Photo of a load box from the top with DUT specific loads, 24V MesSy and electronics supply, measurement system and additional electronics

As illustrated in the following figures the measurement system can be plugged into the DUT specific load box

Measurement system plugged into the load box, VG connectors X1 to X6 marked

Following figure shows the alignment and dimensions of the VG-Connectors, where the correct placement may be found by counting “holes” on the mounting rail:

Mounting rail with VG connectors X6, X4, X2 and X5, X3, X1: total width 21TE = 106,68mm, spacing 5TE = 25,4mm and 7TE = 35,56mm

1.6GND Concept

One important issue is the GND concept, when running lifetime testers. MesSy provides a system GND, to which all internal signals and nearly all digital user channels refer to. For analog measurements additional GND reference inputs are available.

1.6.1Digital GND references

Nearly all digital signals are referenced to System-GND, which is determined by the 24V power supply. Voltage drops are usually less problematic for digital signals, but they should be taken into account.

Following figure illustrates the GND concept of the MesSy and its digital channels:

Digital GND concept: 2x10 digital FET outputs referenced to system GND, 2x2 isolated FET outputs with own GND reference, all base and communication board signals referenced to System GND, GND star in the loadbox

1.6.2Analog GND references for measurement

The GND references for analog measurements are an important issue, since voltages may vary due to voltage drop on the wiring harness. Because of this, analog inputs may be referenced to different voltage levels. These signal levels may vary up to 2,7V over the MesSy system GND, determined by the 24V power supply.

Different reference inputs may also be used to reference the voltage measurements to different DUTs or different GND Pins of one or more DUTs.

Note, that for differential inputs the reference inputs are not relevant, since every channel has its own reference.

Analog GND concept: reference inputs Ref_1 to Ref_4 connected to sensor GND, GND star or system GND; analog input references may have an offset of up to +2,7V from System GND; Ethernet isolated from PC GND; DUT specific power supply

1.7Base and communication board

The base and communication card was designed as a carrier and communication board for the sbRIO. Apart from the supply and mounting holes for the sbRIO, it provides

  • a total of four CAN channels, with transceiver enable
  • up to 10 serial interfaces, with transceiver enable
  • 16 open-collector outputs,
  • 16 TTL- and CMOS compatible general-purpose IOs,
  • three LVDS outputs and two LVDS inputs for communication with the current measurement modules
  • I²C interface for external electronic modules.
  • 3 slots for extensions with NI Compact-RIO c-Series modules

Two microcontrollers with ARM Cortex M3 core are used to provide CAN and serial interfaces; both are used in identical circuits and have separate communication busses as well as separate reset signals to the sbRIO. Deep FIFO buffers for transmission and reception on each interface make sure that no data is lost even when all interfaces are heavily used simultaneously.

1.7.1Block Diagram

Block diagram of the base and communication board: ARM controllers 1 and 2 with serial 1–10 and CAN channels, I2C port expanders for TRIG 1…16 and open collector drivers, LVDS transceiver (CMM), CMOS buffer for RIO_IN 1…6, all connected to the singleboard RIO

1.7.2Specifications

ItemMinTypicalMaxUnit
Supply current including sbRIO @24V (without additional c-Series modules)160240300mA
Supply Voltage202428VDC
Number of CAN channels4
Number of serial interfaces10
Number of open-collector outputs16
Number of general-purpose low speed IOs16
Number of LVDS inputs2
Number of LVDS outputs3
Number of general-purpose high speed inputs6
Number of reserved microcontroller ports4
Number of reserved c-Series slots3

CAN communication

For CAN communication there are 4 CAN channels on the board, distributed on two microcontrollers. One CAN channel of each controller is configured as high-speed and offers software-configurable termination (open/120 Ohm/60 Ohm) by means of reed relays. The other channel has to be connected externally to high- or low-speed transceivers with corresponding termination.

ItemMinTypicalMaxUnit
Supported baud rates1251000kBit/s
CAN V2.0 High-Speed channels2
Configurable (high/low-speed) channels2
Channels with configurable termination2
Selectable Termination resistance60120OpenOhm

Serial and CAN communication lines with external transceivers

For each of the serial interfaces, three pins are connected to the VG connector: RX, TX and Enable. This allows the external connection of transceiver ICs (RS232, LIN, K-Line, discrete level converters) which can be deactivated using the enable signal. All serial interface and CAN signals for external transceivers meet the following specification

ItemMinTypicalMaxUnit
Input Low Voltage-0,50,4V
Input High Voltage2,43,3V
Input Current -0,5V < VIn < 3,3V-1+1µA
Input Resistance VIn >3,3V or VIn <-0,5V220Ohm
Max Output Low Current @VLow < 0,5V01mA
Max Output High Current @VHigh > 2,0V01mA

General Purpose IOs Trig 1…16

16 general purpose IOs are available via an I2C port expander. All IOs are protected with series resistors of 220 Ohm. The interrupt pin of the port expander is connected to the sbRIO to allow fast reaction to changing inputs. The general-purpose IOs are provided via an I²C port expander.

ItemMinTypicalMaxUnit
Input Low Voltage-0,51,5V
Input High Voltage3,55,5V
Input Current -0,5V < VIn < 5,5V-1+1µA
Input Resistance VIn >5,5V or VIn <-0,5V220Ohm
Max Output Low Current @VLow < 0,5V08mA
Max Output High Current @VHigh > 4,0V08mA

Open Collector Outputs 1…16

The open-collector outputs can sink currents up to 400mA each, limited by the maximum current carrying capacity of the copper traces.

ItemMinTypicalMaxUnit
Collector Current per Channel0400mA
Collector Current for 8 channels all overSee figure below

If more than one pin per driver IC is used, the maximum allowable current decreases. The figure below shows the de-rating curve if all outputs are used: at 25°C, 125mA per pin are allowed, at 85°C about 60mA.

De-rating curve output current IOUT versus duty cycle with 8 circuits active, for Ta = 25°C and 85°C

LVDS Interface for CMM

There are three TX lines and two RX lines available for interfacing with LVDS devices like the Current measurement module CMM_II. The copper traces have been routed with a differential impedance of approximately 100 Ohm and the RX lines are terminated with 100 Ohm resistors.

The copper traces have a width of 350µm and a thickness of 35µm. For epsilonr=4.2 and 475µm prepreg height, the characteristic impedance of a single trace is about 80 Ohm. A differentially routed pair of these traces with a distance of 150µm has a differential impedance of 103 Ohm.

ItemMinTypicalMaxUnit
LVDS Inputvoltage range-0.22.7V
LVDS InputTermination100Ohm
LVDS InputDifferential input voltage range100350600mV
LVDS InputCommon mode input voltage range0.31.22.2V
LVDS OutputDifferential output voltage range247350600mV
LVDS OutputCommon mode output voltage range1.1251.251.375V
Typical LVDS Interface Baud rate100125020000kBit/s

General purpose high speed inputs

Six TTL- and CMOS compatible inputs are available which are buffered with a high-speed CMOS buffer and can be used for the acquisition of fast digital signals. The 6 high-speed inputs are protected with a series resistance of 1 kOhm and double schottky diodes. A 100 kOhm pull-down resistor ensures a defined potential, if the inputs are left open. Signals with both 3.3V and 5V voltage level can be connected.

ItemMinTypicalMaxUnit
Input Low Voltage-0,50,8V
Input High Voltage2,05,5V
Input Current -0,5V < VIn < 5,5V-5+5µA
Input Resistance VIn >5,5V1kOhm
TTL-compatibleyes
CMOS-compatibleyes

I²C-Interface

The I²C can be used to control additional external electronic modules.

ItemMinTypicalMaxUnit
Input Low Voltage00,8V
Input High Voltage2,05V
I²C sink current (out direction)24mA
I²C input current (in direction)3mA

C-Series modules

Three C-Series modules can be connected to the three Sub-D connectors of the sbRIO to add further functionality

Microcontroller Flash interface

This interface is used for flashing the Microcontrollers in the self test adapter. This interface is only for IRS internal use.

1.7.3Layout

Layout of the base and communication board: 50-way connector to sbRIO, reserved space for NI single board RIO sbRIO-9602, 24V supply, microcontroller flash, I2C external and reserved C-Series interfaces on the VG connector

1.7.4Connection to sbRIO

The communication board is connected to sbRIO header P2 via a 50 way connector with the following pin assignments.

Pin number P2NameDescription
1GND
2SDAI²C Bus data (port expanders)
3SCLI²C Bus clock (port expanders)
4RX1LVDS RX1 (Interface to CMM)
5RX2LVDS RX1 (Interface to CMM)
6+5V
7TX2LVDS TX2 (Interface to CMM)
8GND
9TX1LVDS TX1 (Interface to CMM)
10+5V
11TX3LVDS TX3 (Interface to CMM)
12GND
13SPI CS (2)SPI BUS Chip select (Microcontroller 2)
14GND
15SPI CLK (2)SPI BUS Clock (Microcontroller 2)
16GND
17SPI MISO (2)SPI BUS MISO (Microcontroller 2)
18GND
19SPI MOSI (2)SPI BUS MOSI (Microcontroller 2)
20GND
21EXT_I2C_SDASDA for external I2C
22GPIO_2_1GPIO pin connection to microcontroller 2
23RIO HIGH-SPEED IN 1High-Speed buffered input
24GND
25RIO HIGH-SPEED IN 2High-Speed buffered input
26GND
27RIO HIGH-SPEED IN 3High-Speed buffered input
28GND
29RIO HIGH-SPEED IN 4High-Speed buffered input
30GND
31RIO HIGH-SPEED IN 5High-Speed buffered input
32GND
33RIO HIGH-SPEED IN 6High-Speed buffered input
34GND
35SPI CS (1)SPI BUS Chip select (Microcontroller 1)
36GND
37SPI CLK (1)SPI BUS Clock (Microcontroller 1)
38GND
39SPI MISO (1)SPI BUS MISO (Microcontroller 1)
40GND
41SPI MOSI (1)SPI BUS MOSI (Microcontroller 1)
42GND
43GPIO_1_1GPIO pin connection to microcontroller 1
44GND
45EXT_I2C_SCLSCL for external I2C
46GND
47PRG_RST_1Reset microcontroller 1
48GND
49PRG_RST_2Reset microcontroller 2
50GND

1.7.5Pinning VG connector X1 (external signals)

PinSignalPinSignalPinSignal
a1OPEN_COLL_16b1OPEN_COLL_15c1OPEN_COLL_14
a2OPEN_COLL_13b2OPEN_COLL_12c2OPEN_COLL_11
a3OPEN_COLL_10b3OPEN_COLL_09c3OPEN_COLL_08
a4OPEN_COLL_07b4OPEN_COLL_06c4OPEN_COLL_05
a5OPEN_COLL_04b5OPEN_COLL_03c5OPEN_COLL_02
a6OPEN_COLL_01b6RIO_IN_05c6n.c.
a7Trig_16b7Trig_15c7Trig_14
a8Trig_13b8Trig_12c8Trig_11
a9Trig_10b9Trig_09c9Trig_08
a10Trig_07b10Trig_06c10Trig_05
a11Trig_04b11Trig_03c11Trig_02
a12Trig_01b12LVDS_IN1-c12LVDS_IN1+
a13RIO_IN_01b13LVDS_IN2-c13LVDS_IN2+
a14RIO_IN_02b14LVDS_OUT1+c14LVDS_OUT1-
a15RIO_IN_03b15LVDS_OUT2+c15LVDS_OUT2-
a16RIO_IN_04b16LVDS_OUT3+c16LVDS_OUT3-
a17Serial_EN_10b17Serial_EN_09c17Serial_EN_08
a18Serial_EN_07b18Serial_EN_06c18Serial_RX_09
a19Serial_TX_08b19Serial_RX_08c19Serial_TX_09
a20Serial_TX_06b20Serial_TX_07c20Serial_RX_07
a21Serial_RX_06b21GPIO_2_4c21GPIO_2_3
a22CAN_STDBY_2Ab22RIO_IN_06c22n.c.
a23CAN_ENABLE_2Ab23CAN_H_2Bc23CAN_L_2B
a24Serial_EN_05b24CAN_TX_2Ac24CAN_RX_2A
a25Serial_EN_02b25Serial_EN_03c25Serial_EN_04
a26Serial_TX_05b26Serial_RX_05c26Serial_EN_01
a27Serial_RX_03b27Serial_TX_04c27Serial_RX_04
a28Serial_TX_02b28Serial_RX_02c28Serial_TX_03
a29GPIO1_4b29Serial_TX_01c29Serial_RX_01
a30Serial_RX_10b30Serial_TX_10c30GPIO_1_3
a31CAN_H_1Bb31CAN_TX_1Ac31CAN_STDBY_1A
a32CAN_L_1Bb32CAN_RX_1Ac32CAN_ENABLE_1A

1.7.6Pinning VG connector X2 (Power supply, Microcontroller Flashing, Reserved)

PinSignalPinSignalPinSignal
B23SCL_ExtC23SDA_Ext
C24µC1_Boot
C25µC1_PRG_RST
C26µC1_RxD
C27µC1_TxD
C28µC2_Boot
C29µC2_PRG_RST
C30µC2_RxD
C31µC2_TxD
a32+24VB32GNDC32GND

Pins C24 to C31 are used for Microcontroller flashing. This procedure is only performed at IRS. Do not connect any signals to these pins.

Pins B23 and C23 are used for connection of additional external modules via I²C. For using the I²C-interface refer to chapter 4.5.

The rest of the second VG connector X2 is almost entirely reserved for future use, especially for the wiring to additional C-series modules, which can be attached to the RIO via three SUB-D connectors and their inputs can be wired to the VG connector. All of the VG connector’s pins have been routed to three 32-way headers for this purpose.

1.7.7Communication line relations

Note, that there are two microcontrollers, which handle both 2 CAN interfaces and 5 serial interfaces, respectively. The following communication lines are assigned to the two microcontrollers according to the following table:

µC1µC2
CAN_1ACAN_2A
CAN_1BCAN_2B
Serial_01Serial_06
Serial_02Serial_07
Serial_03Serial_08
Serial_04Serial_09
Serial_05Serial_10

1.7.8CMM connection

For connection of the CMM, please refer to chapter 4.1.

1.8Analog input board 128x

The analog input board provides 128 analog channels divided into two identical 64-channel subsystems with the following properties:

  • 32 single-ended channels (external reference voltage 1), 0...32V @ 3 kS/s simultaneously
  • 16 single-ended channels (external reference voltage 2) , 0...32V@ 6 kS/s simultaneously
  • 16 differential channels, subdivided in simultaneously sampled groups of 8 channels each, -48...48V @ 150 kS/s in parallel.

To keep input currents as low as possible, no voltage divider was placed at the input of the single-ended channels. By connecting the signal directly to the non-inverting input of the input amplifier, very high input impedance is achieved. It should be noted that this open input causes the amplifiers to drift to the upper supply rail if no input voltage is connected. In this case, the ADCs return all ones (0x3FFF).

An EEPROM memory is provided that can be used to store calibration data, calibration values, an ID, the hardware revision and technical details (e.g. attenuation / gain of each channel).

The analog input board is supplied by a single 24V DC supply as the whole measurement system. A switch mode power supply between the analog measurement subsystems generates positive and negative voltages and LDOs are used for linear regulation of these voltages to provide clean supply rails. Following figure illustrates the power supply unit of the analog input board.

Power supply unit of the analog input board: +24V to Step-Up (+38V) and linear regulator (+35V), Step-Down (+5.6V) and LDO (+5V), Inverting (-6V) and LDO (-5V)

Soft start / power sequencing is included to reduce the inrush current at the moment the power supply is connected.

As shown in the following functional block diagram, the channels are multiplexed to ADCs with two channels each. 32 single-ended channels are handled by a 32:1 multiplexer with address lines ADR1_0 to ADR1_4, the remaining 16 single-ended channels are handled by a 16:1 multiplexer with address lines ADR2_0 to ADR2_3 and the differential channels are switched using two 8:1 multiplexers with shared address lines ADR3_0 to ADR3_2.

All address lines are buffered using high-speed CMOS buffers to reduce the load for the FPGA output drivers and to provide clean signals on the PCB.

1.8.1Block diagram

Block diagram of the analog input board: two 64-channel subsystems, each with Mux 32:1 and Mux 16:1 for single ended inputs and two Mux 8:1 for differential inputs, ADCs below 1.5 MSa/s, buffers and EEPROM to the sbRIO

1.8.2Specifications

ItemMinTypicalMaxUnit
Supply current @24V400440500mA
Supply Voltage222426VDC
Total number of channels128
Number of single-ended channels96
Number of differential channels32

All inputs are converted with a resolution of 14 bits.

The single-ended inputs can be sampled at a rate of 3kSa/s (channels 1-32 and 65-80) / 6kSa/s (channels 33-48 and 81 to 96) each, the differential inputs at more than 150kS/s.

If only one channel is measured, sampling rates of up to 1.2 MSa/s (possibly 1.5MSa) can be achieved.

The differential inputs are frequency-compensated for accurate waveform reproduction.

Specification of single-ended channels

ItemMinTypicalMaxUnit
Input voltage range (referenced to GND)032V
Maximum sample rate (one channel)1.2MSa/s
Maximum sample rate (channel1-32, 49…80)3kSa/s
Maximum sample rate (channel 33-48, 81..96)6kSa/s
Voltage range of reference input vs. GND-0.72.7V
3dB Bandwidth700kHz
Resolution14bit
Accuracy (not calibrated)1.02.0% Full scale
Accuracy (after calibration) @ 5…30V0.10.3% of measured value
Input Current @ 0 … 35V (current flows out of amplifier!)100700nA
Input resistance @ < 0V or >35V10kOhm

Specification of differential channels

ItemMinTypicalMaxUnit
Input voltage range (differential)-4848V
Input voltage range (common mode)-6060V
Maximum sample rate (one channel)1.2MSa/s
Maximum sample rate (all diff. simultaneously)150kSa/s
3dB Bandwidth1500kHz
Resolution14bit
Accuracy (not calibrated)2.04.0% Full scale
Accuracy (after calibration) @ ±5…48V0.61.0% of measured value
Input resistance (positive or negative input referenced to GND)400kOhm
Input resistance (positive and negative input differential)780kOhm

1.8.3Layout

Layout of the analog input board LDSA_MesSy_Analog128 V1.4: 64-channel subsystem 1 (X3, P4), switchmode power supply, 64-channel subsystem 2 (X4, P5)

1.8.4Connection to sbRIO

The card is connected to sbRIO P4 and P5 via two 50 way connectors with the following pin assignment respectively

Pin number P4 / P5NameDescription
1…7n.c.unused
8GND
9
10
11SCLSerial clock of on-board EEPROM
12
13SDASerial data of on-board EEPROM
14GND
15SDO2Serial Data of ADC2
16
17SDOSerial data of ADC1
18GND
19
20GND
21ConvConversion start signal for ADCs
22
23SCKSerial clock for ADCs
24
25
26
27Adr2_0Address line 1 of 16:1 multiplexer
28
29Adr2_1Address line 2 of 16:1 multiplexer
30
31Adr2_2Address line 3 of 16:1 multiplexer
32
33Adr2_3Address line 4 of 16:1 multiplexer
34
35Adr1_4Address line 5 of 32:1 multiplexer
36
37Adr1_3Address line 4 of 32:1 multiplexer
38
39Adr1_2Address line 3 of 32:1 multiplexer
40
41Adr1_1Address line 2 of 32:1 multiplexer
42
43Adr1_0Address line 1 of 32:1 multiplexer
44
45Adr3_2Address line 3 of 8:1 multiplexers
46GND
47Adr3_1Address line 2 of 8:1 multiplexers
48
49Adr3_0Address line 1 of 8:1 multiplexers
50GND

1.8.5Pinning VG connector X3 (external signals Analog subsystem 1)

PinSignalPinSignalPinSignal
a1Diff_In_3b+b1Diff_In_6a+c1Diff_In_1a+
a2Diff_In_3b-b2Diff_In_6a-c2Diff_In_1a-
a3Diff_In_4b+b3Diff_In_7a+c3Diff_In_2a+
a4Diff_In_4b-b4Diff_In_7a-c4Diff_In_2a-
a5Diff_In_5b+b5Diff_In_8a+c5Diff_In_3a+
a6Diff_In_5b-b6Diff_In_8a-c6Diff_In_3a-
a7Diff_In_6b+b7Diff_In_1b+c7Diff_In_4a+
a8Diff_In_6b-b8Diff_In_1b-c8Diff_In_4a-
a9Diff_In_7b+b9Diff_In_2b+c9Diff_In_5a+
a10Diff_In_7b-b10Diff_In_2b-c10Diff_In_5a-
a11Diff_In_8b+b11GNDc11n.c.
a12Diff_In_8b-b12GNDc12+24V
a13n.c.b13n.c.c13+24V
a14n.c.b14n.c.c14n.c.
a15REF_In_2b15n.c.c15REF_In_1
a16REF_In_2b16n.c.c16REF_In_1
a17Sing_In_48b17Sing_In_32c17Sing_In_16
a18Sing_In_47b18Sing_In_31c18Sing_In_15
a19Sing_In_46b19Sing_In_30c19Sing_In_14
a20Sing_In_45b20Sing_In_29c20Sing_In_13
a21Sing_In_44b21Sing_In_28c21Sing_In_12
a22Sing_In_43b22Sing_In_27c22Sing_In_11
a23Sing_In_42b23Sing_In_26c23Sing_In_10
a24Sing_In_41b24Sing_In_25c24Sing_In_9
a25Sing_In_40b25Sing_In_24c25Sing_In_8
a26Sing_In_39b26Sing_In_23c26Sing_In_7
a27Sing_In_38b27Sing_In_22c27Sing_In_6
a28Sing_In_37b28Sing_In_21c28Sing_In_5
a29Sing_In_36b29Sing_In_20c29Sing_In_4
a30Sing_In_35b30Sing_In_19c30Sing_In_3
a31Sing_In_34b31Sing_In_18c31Sing_In_2
a32Sing_In_33b32Sing_In_17c32Sing_In_1

SING_In_1-SING_In_32 are referenced to REF_In_1, SING_In_33-SING_In_48 are referenced to REF_In_2.

1.8.6Pinning VG connector X4 (external signals Analog subsystem 2)

PinSignalPinSignalPinSignal
a1Diff_In_11b+b1Diff_In_14a+c1Diff_In_9a+
a2Diff_In_11b-b2Diff_In_14a-c2Diff_In_9a-
a3Diff_In_12b+b3Diff_In_15a+c3Diff_In_10a+
a4Diff_In_12b-b4Diff_In_15a-c4Diff_In_10a-
a5Diff_In_13b+b5Diff_In_16a+c5Diff_In_11a+
a6Diff_In_13b-b6Diff_In_16a-c6Diff_In_11a-
a7Diff_In_14b+b7Diff_In_9b+c7Diff_In_12a+
a8Diff_In_14b-b8Diff_In_9b-c8Diff_In_12a-
a9Diff_In_15b+b9Diff_In_10b+c9Diff_In_13a+
a10Diff_In_15b-b10Diff_In_10b-c10Diff_In_13a-
a11Diff_In_16b+b11GNDc11n.c.
a12Diff_In_16b-b12GNDc12+24V
a13n.c.b13n.c.c13+24V
a14n.c.b14n.c.c14n.c.
a15REF_In_4b15n.c.c15REF_In_3
a16REF_In_4b16n.c.c16REF_In_3
a17Sing_In_96b17Sing_In_80c17Sing_In_64
a18Sing_In_95b18Sing_In_79c18Sing_In_63
a19Sing_In_94b19Sing_In_78c19Sing_In_62
a20Sing_In_93b20Sing_In_77c20Sing_In_61
a21Sing_In_92b21Sing_In_76c21Sing_In_60
a22Sing_In_91b22Sing_In_75c22Sing_In_59
a23Sing_In_90b23Sing_In_74c23Sing_In_58
a24Sing_In_89b24Sing_In_73c24Sing_In_57
a25Sing_In_88b25Sing_In_72c25Sing_In_56
a26Sing_In_87b26Sing_In_71c26Sing_In_55
a27Sing_In_86b27Sing_In_70c27Sing_In_54
a28Sing_In_85b28Sing_In_69c28Sing_In_53
a29Sing_In_84b29Sing_In_68c29Sing_In_52
a30Sing_In_83b30Sing_In_67c30Sing_In_51
a31Sing_In_82b31Sing_In_66c31Sing_In_50
a32Sing_In_81b32Sing_In_65c32Sing_In_49

SING_In_1-SING_In_32 are referenced to REF_In_1, SING_In_33-SING_In_48 are referenced to REF_In_2.

The reference inputs are protected against signals of more than 2.7V above or 0.2V below ground but this range may only be exceeded for short periods of time!

The +24V supply will be connected to pins C12 & C13 of each VG-connector.

1.8.7Analog Accuracy

To obtain good accuracy a calibration procedure has to be performed. The gain and offset of every channel have to be determined after build-up. The gain and offset values are stored in the EEPROM of the analog input board. They are read at startup, and are used for every analog read out.

Single-ended channels

Following figure shows the typical accuracy of all 96 single ended channels not calibrated

Relative measurement error in percent of the measured value over input voltage 0 to 35 V, single ended channels, not calibrated

Following figure shows the typical accuracy of all 96 single ended channels after calibration

Relative measurement error in percent of the measured value over input voltage 0 to 35 V, single ended channels, after calibration

Differential channels

Following figure shows the typical accuracy of all 32 differential channels, not calibrated.

Relative measurement error in percent of the measured value over input voltage -50 to 50 V, differential channels, not calibrated

Following figure shows the typical accuracy of all 32 differential channels after calibration

Relative measurement error in percent of the measured value over input voltage -50 to 50 V, differential channels, after calibration

1.9Digital Output board

The digital output card provides 64 relays and 24 MOSFETs for general switching purposes. The relays are divided into 48 shutters and 16 changers. The MOSFETs are connected as open-drain low side switches and can handle up to 60V and 3A. However, the VG connector is only specified for 2A per pin so a current of 2A should not be exceeded. The overall current of all 10 FETs that switch to GND should be kept below 14A.

4 of the 24 transistors are galvanically isolated from the rest (and from each other).

The MOSFETs can each be switched directly from I/O pins of the sbRIO: a logical 0 turns the MOSFET on, a logical 1 off. Every MOSFET output may be used for fast switching applications as PWM.

The relays have to be accessed through I²C port expanders. All port expanders are connected to the same I²C bus but have different addresses. The port expanders switch the relays with help of powerful driver ICs.

The Relais_FET_LDSA card consists of two identical subsystems. The MOSFET part and the port expanders of the card are powered from the sbRIO; the relays need an additional 24V supply on the VG connectors X5, X6.

1.9.1Block Diagram

A functional block diagram is shown below that illustrates how each of the subsystems works (i.e. one half of the total system).

Block diagram of one digital output subsystem: 50-way VG connector to sbRIO, I2C bus to port expanders 1 and 2 with drivers for 16 shutters, 8 shutters and 8 changers, 10 GND-referenced and 2 isolated open-drain MOSFET outputs, 96-way VG connector with 24V supply

1.9.2Specifications

ItemMinTypicalMaxUnit
Supply current @24V all Relays open4720mA
Supply current @24V all Relays on600700800mA
Supply Voltage222426VDC
Number of shutter relays48
Number of changer relays16
Number of open drain to System GND20
Number of open drain isolated4

Open Drain MOSFET Outputs

ItemMinTypicalMaxUnit
voltage range60V
continuous current (limited by connector)02A
RDS(on) @60100150mOhm
Fall time tf0,51µs
Rise time tr @ RPullup = 1 kOhm0,51µs

Relays- Shutters

ItemMinTypicalMaxUnit
Switching Voltage60VDC or VACpeak
Switching current1.0A
Carry current1.25A
Contact resistance200mOhm
Life expectation @5 V / 10mA1000x106 cycles

Relays- Changeover

ItemMinTypicalMaxUnit
Switching Voltage60VDC or VACpeak
Switching current1.0A
Carry current1.0A
Contact resistance @6V 10mA50mOhm
Life expectation @ no load1000x106 cycles
Life expectation @6 V / 100mA50x106 cycles

Following figure shows the maximum switching voltage, dependent on the switching current of the changeover relays.

Maximum switching voltage (DC) over switching current (DC) of the changeover relays, 30 Watts limit and recommended field of application

1.9.3Layout

Layout of the digital output board: subsystem 1 with open drain 11-12 (isolated), open drain 1-10, changers 25-32, shutters 17-24 and 1-16; subsystem 2 with MOSFETs 23-24 (isolated), open drain 13-22, changers 57-64, shutters 49-56 and 33-48

1.9.4Connection to sbRIO

The card is connected to sbRIO header P3 via a 50 way ribbon cable. The corresponding connector has the following pin assignments. Make sure the card is not connected to any other connector than P3 of the sbRIO!

Pin number P3NameDescription
1GND
2Open Drain 13
3Open Drain 14
4GND
5Open Drain 15
6GND
7Open Drain 16
8GND
9Open Drain 17
10GND
11Open Drain 18
12Open Drain 19
13Open Drain 20
14GND
15Open Drain 21
16GND
17Open Drain 22
18GND
19Open Drain 23 (isolated)
20GND
21Open Drain 24 (isolated)
22GND
23Open Drain 1
24GND
25Open Drain 2
26GND
27Open Drain 3
28GND
29Open Drain 4
30GND
31Open Drain 5
32reserved
33Open Drain 6
34GND
35Open Drain 7
36GND
37Open Drain 8
38GND
39SDA (I²C)
40GND
41SCL (I²C)
42GND
43Open Drain 9
44+5V supply
45Open Drain 10
46GND
47Open Drain 11 (isolated)
48+5V supply
49Open Drain 12 (isolated)
50GND

1.9.5Pinning VG connector X5 (external signals digital subsystem 1)

PinSignalPinSignalPinSignal
a1Rel1 (COM)b1Rel2 (COM)c1Rel3 (COM)
a2Rel1 (NO)b2Rel2 (NO)c2Rel3 (NO)
a3Rel4 (COM)b3Rel5 (COM)c3Rel6 (COM)
a4Rel4 (NO)b4Rel5 (NO)c4Rel6 (NO)
a5Rel7 (COM)b5Rel8 (COM)c5Rel9 (COM)
a6Rel7 (NO)b6Rel8 (NO)c6Rel9 (NO)
a7Rel10 (COM)b7Rel11 (COM)c7Rel12 (COM)
a8Rel10 (NO)b8Rel11 (NO)c8Rel12 (NO)
a9Rel13 (COM)b9Rel14 (COM)c9Rel15 (COM)
a10Rel13 (NO)b10Rel14 (NO)c10Rel15 (NO)
a11Rel16 (COM)b11Rel17 (COM)c11Rel18 (COM)
a12Rel16 (NO)b12Rel17 (NO)c12Rel18 (NO)
a13Rel19 (COM)b13Rel20 (COM)c13Rel21 (COM)
a14Rel19 (NO)b14Rel20 (NO)c14Rel21 (NO)
a15Rel22 (COM)b15Rel23 (COM)c15Rel24 (COM)
a16Rel22 (NO)b16Rel23 (NO)c16Rel24 (NO)
a17Rel25a (NC)b17Rel26a (NC)c17Rel27a (NC)
a18Rel25a (NO)b18Rel26a (NO)c18Rel27a (NO)
a19Rel25a (COM)b19Rel26a (COM)c19Rel27a (COM)
a20Rel28a (NC)b20Rel29a (NC)c20Rel30a (NC)
a21Rel28a (NO)b21Rel29a (NO)c21Rel30a (NO)
a22Rel28a (COM)b22Rel29a (COM)c22Rel30a (COM)
a23Rel31a (NC)b23Rel32a (NC)c23+24V
a24Rel31a (NO)b24Rel32a (NO)c24+24V
a25Rel31a (COM)b25Rel32a (COM)c25+24V
a26Open_Drain1b26Open_Drain8c26GND
a27Open_Drain2b27Open_Drain9c27GND
a28Open_Drain3b28Open_Drain10c28GND
a29Open_Drain4b29GNDc29Open_Drain11
a30Open_Drain5b30GNDc30GND_ISO_11
a31Open_Drain6b31GNDc31Open_Drain12
a32Open_Drain7b32GNDc32GND_ISO_12

The open-drain outputs 1 to 10 all switch to GND while the isolated open-drain 11 and 12 switch to separate pins (GND_ISO_11 and GND_ISO_12).

1.9.6Pinning VG connector X6 (external signals digital subsystem 2)

PinSignalPinSignalPinSignal
a1Rel33 (COM)b1Rel34 (COM)c1Rel35 (COM)
a2Rel33 (NO)b2Rel34 (NO)c2Rel35 (NO)
a3Rel36 (COM)b3Rel37 (COM)c3Rel38 (COM)
a4Rel36 (NO)b4Rel37 (NO)c4Rel38 (NO)
a5Rel39 (COM)b5Rel40 (COM)c5Rel41 (COM)
a6Rel39 (NO)b6Rel40 (NO)c6Rel41 (NO)
a7Rel42 (COM)b7Rel43 (COM)c7Rel44 (COM)
a8Rel42 (NO)b8Rel43 (NO)c8Rel44 (NO)
a9Rel45 (COM)b9Rel46 (COM)c9Rel47 (COM)
a10Rel45 (NO)b10Rel46 (NO)c10Rel47 (NO)
a11Rel48 (COM)b11Rel49 (COM)c11Rel50 (COM)
a12Rel48 (NO)b12Rel49 (NO)c12Rel50 (NO)
a13Rel51 (COM)b13Rel52 (COM)c13Rel53 (COM)
a14Rel51 (NO)b14Rel52 (NO)c14Rel53 (NO)
a15Rel54 (COM)b15Rel55 (COM)c15Rel56 (COM)
a16Rel54 (NO)b16Rel55 (NO)c16Rel56 (NO)
a17Rel57a (NC)b17Rel58a (NC)c17Rel59a (NC)
a18Rel57a (NO)b18Rel58a (NO)c18Rel59a (NO)
a19Rel57a (COM)b19Rel58a (COM)c19Rel59a (COM)
a20Rel60a (NC)b20Rel61a (NC)c20Rel62a (NC)
a21Rel60a (NO)b21Rel61a (NO)c21Rel62a (NO)
a22Rel60a (COM)b22Rel61a (COM)c22Rel62a (COM)
a23Rel63a (NC)b23Rel64a (NC)c23+24V
a24Rel63a (NO)b24Rel64a (NO)c24+24V
a25Rel63a (COM)b25Rel64a (COM)c25+24V
a26Open_Drain13b26Open_Drain20c26GND
a27Open_Drain14b27Open_Drain21c27GND
a28Open_Drain15b28Open_Drain22c28GND
a29Open_Drain16b29GNDc29Open_Drain23
a30Open_Drain17b30GNDc30GND_ISO_23
a31Open_Drain18b31GNDc31Open_Drain24
a32Open_Drain19b32GNDc32GND_ISO_24

The open-drain outputs 12 to 22 all switch to GND while the isolated open-drain 23 and 24 switch to separate pins (GND_ISO_23 and GND_ISO_24).

1.9.7PWM timing with MOSFETs

All Open Drain outputs, including the isolated ones, can be used for PWM generation.

The following figure shows the typical timing behaviour of a MOSFET output with an external pull-up of 1 kOhm connected

Oscilloscope capture of a MOSFET output with 1 kOhm pull-up: period approx. 10 µs, duty cycle approx. 49.8 %

Note that with pull-up resistors of higher resistance, higher rise times will occur. The fall time is quite independent of the pull-up resistor size.

The sbRIO-SW uses a timing resolution of 1µs. If necessary, the resolution can be adjusted up to 25ns. But note, that this would reduce maximum period of signal generation.

Chapter 2

Measurement system internal interfaces

2.1SPI interface

The two controllers communicate with the sbRIO with two separate SPI buses that can run at clock rates of up to 18MHz. The microcontrollers are configured as slaves. They can activate an interrupt line in order to force FPGA of sbRIO (which is master) to retrieve microcontroller data. The data size is always 16 bit (referenced as one word).

2.1.1Transmission protocol

The following communication protocol is used for communication in both directions (FPGA to microcontroller, microcontroller to FPGA).

WordNameRange/value
0LEN (number of data words) N1…65535
1 (high byte)SIGNATUREalways 0x4D
1 (low byte)CRC8 (of all following data bytes)0x00…0xFF
2 (high byte)COMMAND0x00…0xFF
2 (low byte)DATA (byte 0)0x00…0xFF
………
2+N-1 (low byte)DATA (byte N-1)0x00…0xFF

It must be noticed that only the low byte of the data area is used. The high byte always contains the constant 0x40 for data messages (except data word 0, which contains the command byte additionally) or 0x80 for status messages (compatibility reasons, FPGA discards received data words with a value less or equal to 0x00FF). A data word with a value of 0x0000 will be added automatically by the microcontroller in order to clear its SPI buffer.

2.1.2Status codes

Each command received from sbRIO will be answered by the microcontroller. This can be done by a data message (which contains application data processed by RT/PC) or a status message. It is possible to deactivate this functionality by command.

The following status codes are defined.

ValueContent
0x01ACK (command processed successfully, but no data bytes to send for response)
0x02PAR (at least one parameter is out of range)
0x04CMD (command not known)
0x08IDX (object index out of range)
0x10CRC (checksum verification failed)
0x20SIG (wrong signature read)
0x40TIM (SPI timeout detected)
0x80LEN (command length mismatching)

2.1.3Command description

The latest descriptions can be found in the VI documentation.

2.2Non-volatile storage of data

The on-board data flash of the two STM32 can be used as an EEPROM for the non-volatile storage of data (for example baud rates, ID filter settings, termination resistances …).

2.3Analog Input

The interface of the analog input board consists of

  • 3 address buses for multiplexing the analog channels for every analog group separately
  • Signals for the serial communication with the ADCs.
  • Serial interface to the EEPROM for calibration data.

2.3.1Multiplexers

As shown in the functional block diagram, the channels are multiplexed to ADCs with two channels each. 32 single-ended channels are handled by a 32:1 multiplexer with address lines ADR1_0 to ADR1_4, the remaining 16 single-ended channels are handled by a 16:1 multiplexer with address lines ADR2_0 to ADR2_3 and the differential channels are switched using two 8:1 multiplexers with shared address lines ADR3_0 to ADR3_2.

All address lines are buffered using high-speed CMOS buffers to reduce the load for the FPGA output drivers and to provide clean signals on the PCB.

The address lines are switched during the ADC hold phase to avoid influencing the conversion results.

The inputs are sampled by the internal Sample & Hold stage of the ADCs between the 32nd rising edge of SCK and the rising edge of CONV.

2.3.2ADCs

LTC1407A-1 timing diagram with SCK, CONV, internal S/H status and SDO, and timing parameter table (sampling frequency, throughput, clock period, conversion time, t1 to t12)

Both ADCs are clocked by the same CONV and SCK signals.

The ADC outputs are buffered using high-speed CMOS buffers to drive the ribbon cable’s capacitance.

2.3.3EEPROM

The EEPROM contains an ID to identify the PCB as an analog measurement card, the type (128 or 64 channel version), a calibration timestamp and the hardware version. Furthermore offset and gain calibration data for each channel is stored as well as the input voltage scaling factor according to the resistor dividers on the PCB. There is an EEPROM present for every analog subsystem respectively. Following table shows an excerpt of the EEPROM content. A detailed memory map can be found in the separate file “EEPROM Memory Map Analog_LDSA.xlsx”.

AddressContentValuesComment
0ID0xAAIdentifies the PCB as analog measurement card
1Hardware revisione.g. 0x14Hardware revision: e.g. Version 1.3 => 0x13
2Hardware revision: e.g. Version 1.3 => 0x13
3Calibration timestamp upper byte0x02Date of last calibration: e.g. 16.08.2010 => 160810 = 0x2742A
4Calibration timestamp middle byte0x74Date of last calibration: e.g. 16.08.2010 => 160810 = 0x2742A
5Calibration timestamp lower byte0x2ADate of last calibration: e.g. 16.08.2010 => 160810 = 0x2742A
6
7
8
9Offset byte 1 single-ended channel 1Bit31…24Offset in Steps of µV
10Offset byte 2 single-ended channel 1Bit23…16Offset in Steps of µV
11Offset byte 3 single-ended channel 1Bit15…8Offset in Steps of µV
12Offset byte 4 single-ended channel 1Bit7…0Offset in Steps of µV
13Gain byte 1 single-ended channel 1Bit31…24Gain of input voltage divider multiplied by 109
14Gain byte 2 single-ended channel 1Bit23…16Gain of input voltage divider multiplied by 109
15Gain byte 3 single-ended channel 1Bit15…8Gain of input voltage divider multiplied by 109
16Gain byte 4 single-ended channel 1Bit7…0Gain of input voltage divider multiplied by 109
17Offset byte 1 single-ended channel 2Bit31…24Offset in Steps of µV
18Offset byte 2 single-ended channel 2Bit23…16Offset in Steps of µV
19Offset byte 3 single-ended channel 2Bit15…8Offset in Steps of µV
20Offset byte 4 single-ended channel 2Bit7…0Offset in Steps of µV
21Gain byte 1 single-ended channel 2Bit31…24Gain of input voltage divider multiplied by 109
22Gain byte 2 single-ended channel 2Bit23…16Gain of input voltage divider multiplied by 109
23Gain byte 3 single-ended channel 2Bit15…8Gain of input voltage divider multiplied by 109
24Gain byte 4 single-ended channel 2Bit7…0Gain of input voltage divider multiplied by 109
:::
:::
511Gain byte 3 differential channel 15Bit15…8Gain of input voltage divider multiplied by 109
512Gain byte 4 differential channel 15Bit7…0Gain of input voltage divider multiplied by 109
513Offset byte 1 differential channel 16Bit31…24Offset in Steps of µV
514Offset byte 2 differential channel 16Bit23…16Offset in Steps of µV
515Offset byte 3 differential channel 16Bit15…8Offset in Steps of µV
516Offset byte 4 differential channel 16Bit7…0Offset in Steps of µV
517Gain byte 1 differential channel 16Bit31…24Gain of input voltage divider multiplied by 109
518Gain byte 2 differential channel 16Bit23…16Gain of input voltage divider multiplied by 109
519Gain byte 3 differential channel 16Bit15…8Gain of input voltage divider multiplied by 109
520Gain byte 4 differential channel 16Bit7…0Gain of input voltage divider multiplied by 109

2.4Digital output

As shown in the block diagram, the relays can be accessed via two I²C port expanders. All pins are configured as inputs at power-up and must be reconfigured as outputs before the relays can be switched.

Addresses for write access:

  • Port expander 1 (relays 01 to 15): 0b11101000 = 0xE8
  • Port expander 2 (relays 16 to 32): 0b11101100 = 0xEC
  • Port expander 3 (relays 33 to 48): 0b11101110 = 0xEE
  • Port expander 4 (relays 49 to 64): 0b11101010 = 0xEA

The LSB is set to zero for write access.

Write to output ports:

I2C timing: write to output ports with slave address, command byte, data to port 0 and data to port 1

Write to configuration registers:

I2C timing: write to configuration registers with slave address, command byte and data to register

Chapter 3

External extension Interfaces

3.1Supply current measurement – CMM-Interface

For measurement of the DUT current consumption an external IRS current measurement module (CMM) can be inserted. The module is supplied externally and can be read by means of a synchronous serial channel with LVDS differential digital signalling.

The serial interface is designed in a way to concatenate several CMM’s in a daisy chain type, as illustrated in the following figure, where the test system is actually the LVDS interface, which is available on the base and communication board.

Daisy chain of CMM A, B and C: test system sends Clk_In, En_In, Rx; each CMM forwards Clk_Out, En_Out, Tx; receive data of 3x CMM when asserting En for 3x32 clock cycles, starting with data of CMM C

3.1.1Communication protocol

The protocol for reading data of one current measurement module is as follows:

Timing of Clk_In, En_In, Rx and Tx: current bits 31 to 0 sent in two 16-bit blocks with a pause of more than 5 µs between them, followed by the forwarded Rx bits

When En_In is asserted, the CMM_II module sends out its current measurement value during the next 32 clock cycles with MSB first. After every 16th clock cycle a pause of approx. 5µs with CLK_In at low level should be left. This delay is used to leave the CMM_II microcontroller time to sort next 16-bit data word. After 32 clock cycles the previously received data word is forwarded by the CMM.

Thus, En_in must be valid for 32 clock cycles, multiplied by number of CMMs in the chain.

The current is returned as 32 Bit unsigned long value in steps of 100nA.

3.1.2Connection Diagram

The connection of the signals is according to the following table:

MesSy signalMesSy PinCMM_II SignalCMM_II PinWhich CMM_II
LVDS_Out_3+B16Rx+B17First in chain
LVDS_Out_3-C16Rx-C17First in chain
LVDS_Out_2+B15En_In+B16First in chain
LVDS_Out_2-C15En_In-C16First in chain
LVDS_Out_1+B14Clk_In+B15First in chain
LVDS_Out_1-C14Clk_In-C15First in chain
LVDS_In_1+C12Tx+ (last CMM)B18Last in chain
LVDS_In_1-B12Tx-C18Last in chain

Following example shows the connection of the communication lines of two CMMs:

Wiring example of two CMMs (CMMII_DUT1 and CMMII_DUT2) to the MesSy connector X1 via VG_24+8 connectors, 0,5 mm² wires for supply and LVDS lines

3.2Analog or digital output conditioning

For conditioning of digital outputs or using analogue outputs, please refer to document LDSA_MesSy_Guide_HW_V_1_1.docx

3.3External CAN or serial transceivers

For conditioning of digital outputs refer to document LDSA_MesSy_Guide_HW_V_1_1.docx

3.4Analog input conditioning

For conditioning of analog inputs using voltage dividers or load current measurements, please refer to document LDSA_MesSy_Guide_HW_V_1_1.docx, and the data sheet CurrentConverter_8x_Datasheet_V1.0.pdf.

3.5External I2C-interface

MesSys with a base- and communication board of version 1.3 or higher provide an external I²C-interface to connect additional external electronic modules. Any devices compatible to the I²C-specification may be connected to this interface.

At the moment IRS provides two external modules, which can be controlled by this interface:

  • 64x Relay board (identical to one Relay subsystem on MesSy’s digital output board)
  • 16x analogue output board (output DC voltages 0…20V)

I²C-interface contains two signal lines. The signals are available at MesSy connector X2 according to the table in chapter 2.7.6 with the following functionality. A typical I²C example telegram for controlling digital outputs is shown in chapter 3.4.

SignalX2- PinDescription
SCL_ExtB23clock line
SDA_ExtC23bidirectional data line
Chapter 4

SW Description

In the following chapter the software concept is introduced. Starting with a general overview, block diagrams of SW subsystems, description of the communication between the SW subsystems, and finally a short functional description of the functional blocks.

For lifetime testing, software for test configuration, data logging and test execution is necessary. These software parts are not described in this document. IRS provides a complete SW solution for lifetime testing which contain additionally to the software described in the following chapter:

  • PC-Host-Software
    • User interface (GUI)
    • TestStand controller (TSC)
    • TestStand including test procedure which accesses the measurement system API functions

For description of these software parts, contact IRS.

For the measurement system the following sub-systems are introduced in the following chapter:

  • PC-Host-Software
    • Base communication to measurement system (PC to RT communication)
    • SW for controlling and querying the separate functional blocks
    • Signal mapping for accessing analog, digital and communication channels by DUT specific signal name
  • Measurement system Software:
    • LabVIEW RT software running on sbRIO RT controller
    • LabVIEW FPGA software running on sbRIO FPGA
    • Microcontroller software running on communication board’s microcontroller

4.1Lifetime testing SW layers

Following block diagram illustrates the different software layers of typical lifetime test equipment, with focus on the measurement system software (yellow). The blue marked SW parts are the generic IRS user interface and TestStand from National Instruments.

Software layers of a lifetime tester: LDSA GUI, TestStand controller and sequence, hardware abstraction layers (measurement system labelled channels API, measurement system API), PC to MesSy communication, LabVIEW RT, RT to FPGA communication, LabVIEW FPGA, measurement system hardware and external system hardware

4.2Measurement system embedded software

Embedded software of the measurement system: measurement system API and hardware abstraction layer on the PC, generic communication via NI STM library, RT data processing with CAN command-response handling and sub-sequencer, generic communication via DMA FIFOs, FPGA data processing (PWM generator, analog continuous supervision), hardware control and hardware

4.2.1Overview FPGA-SW

Next block diagram shows the entire FPGA design with its functional blocks, running on sbRIO FPGA:

LabVIEW FPGA block diagram with analog sampling, general system control (HW-Version, SW-Version, temperature, LED), system timer, RT to FPGA command handler, static digital outputs, PWM generation, Analog Signal SuperVision (SSV), microcontroller communication (CAN, Serial) and current measurement module query

The block diagram contains several Sub-VIs, which handle all FPGA data processing according to the following VI hierarchy:

FPGA VI hierarchy with FPGA top level design, system timer, RT to FPGA command handler, Analog Signal SuperVision (SSV), microcontroller communication, PWM generation, analog sampling, current measurement module query, EEPROM read write and static digital outputs

The Sub-VIs are not described in detail, since this would go beyond the scope of this document. To understand the functionality of the blocks, the source code should be investigated.

4.2.2Overview RT-SW

Following block diagram shows the top level RT-design running on the sbRIO RT controller:

After power up, RT-SW initializes the FPGA reference and performs all DMA channel settings for the communication with the FPGA.

Afterwards RT-SW waits for a connection request from the host PC. After connection has been established RT-SW always waits for a command from the host PC to execute.

With every command (e.g. setting digital outputs, request analog values, send CAN command, …) the following steps are performed:

  • Call command handler
  • Read parameters
  • Execute command
  • Return response

After the host PC closes the connection, the loop, while waiting for a command is aborted, Ethernet connection is closed, and RT-SW again waits for a new connection to the PC host.

At the moment no other tasks are necessary for RT-SW. There are several options to implement further extensions to this software, including parallel tasks for calculation, running models,….

Top level RT design: initialization and read of internal SW versions, PC host connection check background loop every second, open new PC host connection, check valid PC host connection, wait for command, execute command, return response, de-initialization after the connection is closed, RunState LED control background task, cleanup code

The block diagram contains several sub-VIs, which handle all RT data processing according to the following VI hierarchy:

RT VI hierarchy

The sub-VIs are not described in detail, since this would go beyond the scope of this document. To understand the functionality of the blocks, the source code should be investigated.

4.2.3RT to FPGA communication

Communication via Read/Write-Controls

Commands which do not have to pass larger data blocks from RT to FPGA or vice versa, use simple read/write controls to send data to, or read data from FPGA. For example see the command handler case for setting digital outputs from the RT point of view:

Command handler case DIG_REL_SetAll: unpack command parameters and write the RW-Control DIG_REL_1to64 to the FPGA

See also the FPGA block diagram in chapter 5.2.1 to see all available Read-Write Controls: (Temperature, digital outputs, Timestamp, Reset, CMM, …)

Communication via DMA from FPGA point of view

For passing larger data blocks from RT to FPGA or vice versa, DMA channels can be used. The following structure, which can be found in the figure of chapter 5.2.1, handles the DMA communication:

FPGA_COMM structure: RT to FPGA DMA FIFO read into RT to FPGA buffer, FPGA_command_handler with RT to FPGA and FPGA to RT data buffer content (command, data length N, reserved or error code, data bytes), command specific execution, FPGA to RT DMA FIFO write; signals Communication_Request and Communication_Ready

Communication via DMA from RT point of view

The following steps are performed for RT to FPGA communication:

RT side of the DMA communication: reset command request, clear RT to FPGA DMA FIFO, wait till FPGA is ready for communication, send command, read FPGA to RT DMA FIFO until the entire response has been sent, reset command request, add error code in case of error

4.3PC to RT communication

4.3.1STM library

Communication between the PC Host interface and the measurement system RT-controller is established by an Ethernet connection. A protocol is implemented, based on the National Instruments STM-library, using TCP/IP Protocol.

Every command or response packet handled by the STM library contains the following data string:

STM data string: Data Size (32 bits), Meta Data ID (16 bits), Data

The command field “Metadata“, is an ID, which represents an element of the array of valid commands. The figure below shows an example of the used commands of the measurement system.

Meta data is transmitted once from the PC host to the RT target, after connection has been established by the host PC. This makes sure, that both PC and RT both know the same valid commands, using same IDs.

Array of valid commands (MetaData): ACK, SUBSEQUENCE, SYS_, ANA_, DIG_, PWM_, SSV_, CMM_, EEPROM_, SPI_ and CAN_ commands

4.3.2Normal command execution from PC point of view

Normal command execution means that PC sends a command. RT executes the command and sends a response immediately. The following steps are performed from the PC side of view:

  1. Pack parameters to command string:
    • This step is command specific, and means to pack any command parameters to a string
  2. Send command string to RT:
    • This step is included in the generic communication routine, which sends the command string to the RT-Target
  3. Get response string from RT:
    • This step is included in the generic communication routine, which waits for the response string from the RT-Target
  4. Unpack parameters from response string:
    • This step is command specific, and means to extract any response parameters from string

LabVIEW block diagram of a command from PC point of view: 1. pack parameters to command string, 2. send command string to RT, 3. get response string from RT (generic communication routine, see chapter 5.3.3), 4. unpack response string to return parameters

4.3.3Slot addressing

Note that for every command a slot parameter is passed. The purpose of this parameter is to distinguish between several DUTs on one measurement system. I.e. for DUTs with only little amount of pins and functions, one measurement system can be used to handle up to 6 DUTs in parallel. In this case, when more than one test executions are connecting to the measurement system, the communication routine has to check the connections for every DUT’s test execution. It may not close the connection, until all test executions of all DUTs have closed the connection. Thus, the slot represents the DUT on the measurement system.

4.3.4Generic communication routine

The generic communication routine is used for every command sent by the PC. Following figure illustrates the steps of this routine.

Generic communication routine: add command counter to make sure that the response fits to the command, send command (STM_Library), receive response (STM_Library), check on errors and check command counter

4.3.5Normal command execution from RT point of view

The following figure shows the loop for command reception, which is continuously running on RT:

RT command reception loop: check connection, read command string, check normal or sub sequencer execution, command handler for normal execution, send response string

The command handler selects and executes the command:

RT command handler: input parameters from command, extract parameters from string, execute depending on command type, different available commands, build response string, add error code in case of error

4.4Command flow

4.4.1Normal command execution

The following figure illustrates a typical command flow from PC side of view. In this case the measurement system functions are used within a LabVIEW Application:

Typical command flow in LabVIEW: 1. open connection (default port is 55555), 2. set Safe-State timeout to appropriate size (PC_SYS_SetSbRioCmdWaitTimeout.vi), 3. call several commands depending on the application, 4. close connection when finishing the application

The same steps have to be taken, when accessing the measurement system from TestStand or other applications. Following figure shows a typical execution flow within TestStand

NI TestStand sequence editor with a typical execution flow: Open PC_COMM, sbRIO_CMD_Wait_Timeout, reset timestamp, CMM, version, temperature and CAN settings steps, step settings of PC_SYS_ResetUc.vi

Step 1:

Open the connection to establish the TCP-IP connection, exchange Meta-data between PC and RT.

Step 2:

Call “PC_SYS_SetSbRioCmdWaitTimeout.vi” to set the “safe-state”-timeout to an appropriate size. This timeout means the following. If the measurement system (RT-SW) did not receive a valid command within this timeout period, the RT-SW will switch all outputs off, resets the CAN-Controllers, disconnects TCP-IP-connection and waits for a new open request. The purpose of this timeout is to make sure that the measurement system returns to an idle state and switches off the DUT when the PC had been crashed.

The default value of this timeout is 2 seconds. I.e. every 2 seconds a command has to be sent by PC. This cannot be achieved in all applications. Especially, when the user wants to send commands by triggering buttons, the timeout has to be set to higher values. A typical value for a non-sensitive device would be 60 seconds. Devices like window lifters, which could be damaged when be in an uncontrolled, active state require shorter timeouts, well below 5 seconds. The user may decide the appropriate timeout for his application.

Step 3: (can be repeated indefinitely)

Sending commands as listed in the API description in Measurement system API (CORE_API), or as in Lifetime testing API with labelled channels (TS_API) can be performed application specific in an arbitrary way.

Step 4:

Before closing the application, the connection should be closed. Otherwise the measurement system would still wait for a command, and run into the “safe-state”-timeout at any specified time. When the user tries to re-open the connection to the measurement system, while it is still running, an error would be reported. Thus close connection, before closing the application.

4.4.2Sub-Sequencer execution

The sub-sequencer is implemented to execute commands fast in a well-defined timing in the range of a few milliseconds. When sending commands using normal command execution, the timing between commands is dependent on the timing of the Windows operating system on the PC. With such a non-real-time operating system timing can vary between a few milliseconds up to seconds.

Sub-sequencer execution means to load several commands to RT, execute them without delays caused by the PC and return several responses to PC. The responses can be evaluated on the PC-SW with a non-critical varying timing.

Sub-sequencer command flow

The following command flow must be implemented to use a subsequence

Sub-sequencer command flow: execution thread on host PC with optional Remove Subsequence, Create Subsequence, COMMAND_XXXX Add to Subsequence (repeated for any number of commands), PC_SUBSEQUENCER_ExecuteSubsequence (download to RT, execute and read back all responses), COMMAND_XXXX GetResult; RT-SW executes the commands of Sequence 1 and cumulates the responses in a string array

Sub-sequencer command execution from RT point of view

Sub-sequencer execution from RT point of view simply means to receive an array of command strings from PC. The array, containing single command strings to execute, is processed element by element. Responses of the single commands are cumulated in an array of strings and returned to the PC.

RT sub-sequencer case: expect an array of commands to execute, loop over all commands in the command array, normal command execution for every loop step

Sub-Sequencer command execution from PC point of view

Sub-Sequencer execution from the PC point of view means to split the command-response handling unit into three parts:

  • add command to subsequence (repeatedly for several commands)
  • Execute entire subsequence
  • Get subsequence response (repeatedly for several commands)

The separation between normal command execution, sub sequencer-“load” and sub sequencer– “get result” is implemented, using polymorphic VIs. The sub-sequencer execution is explained in the following, using the example VI: “CAN_EOL_SendReceive.vi”:

In the first step the normal command execution of CAN_EOL_SendReceive.vi is illustrated to see the difference to sub sequencer-execution

CAN_EOL_SendReceive normal execution:

CAN_EOL_SendReceive normal execution: EOL-specific data handling for command, send multiple CAN messages, response error handling

Can_SendMultipleMsgs:

Can_SendMultipleMsgs: convert message to command string, generic communication routine (see chapter 5.3.3), convert response string to EOL message

For sub sequencer execution the three coloured parts have to be separated into several VIs. The “Execute Subsequence” part is a generic one, and can be used from every command. But for every command the following parts have to be implemented separately, using polymorphic VI’s:

  • COMMAND_XXX_AddToSubsequence
    • contains the formatting of the command string, and save the command string in the identified subsequence command container
  • COMMAND_XXX_GetResult
    • Contains the reading of the response string of the identified sequence and step. The formatted response string is unpacked and converted to appropriate response parameters.

Add to Subsequence (command specific)

Add to Subsequence: EOL-specific data handling for command and conversion of the message to a command string, load command string into named subsequence with named step

Execute Subsequence (one generic VI for all commands)

Execute Subsequence: bundle all command strings loaded to the named subsequence to one string, execute all commands of the subsequence, unbundle all command strings returned from the subsequence as one string

GetResult (command specific)

GetResult: load command string from named subsequence with named step, convert response string to EOL message and response error handling

4.5Error Handling

4.5.1General error handling

Every implemented VI has an error input and output.

Front panel of a VI with inputs (IP Address, Slot, Channel_Type, Channel_Nr, Nr_Samples), outputs (Waveform) and error handling clusters error in and error out with status, code and source

Error codes are returned by all VI’s in the “error out”-cluster.

If an error with a non-zero error code is passed to the VI on “error in”

  • the VI’s code is not executed
  • the error code is passed through to “error out”

It is recommended to wire the error input and output to any user defined error handler in the application. This makes sure that communication to MesSy and all Parameters are checked and the user of the application gets information about the MesSy and Software status.

4.5.2Error Codes

In the field “code” of “error out” an error code is returned, which is either generated by any VI of the standard LabVIEW library, or by the MesSy software. Values below 5000 including negative values are standard LabVIEW error codes. Values above are MesSy error codes.

The MesSy error codes use the following grouping:

Bit 30..24Bit 23..16Bit 15…0
ClassificationSourceType

Classification defines the criticality of the error, where a system error is regarded as a severe error.

A DUT error means, that the MesSy system is still working, but for example a CAN message has not been answered by the unit under test.

A warning may be regarded only for information.

NumberClassification
0x10System Error
0x20DUT Error
0x30Warning

Source means the software block, which has detected an error.

NumberSourceDescription
0x00SYSGeneral system control, e.g. timestamp, IP-connection, …
0x10CANCAN communication
0x20PWMDynamic digital output generation
0x30ANALOGAnalog input
0x04SSVSignal supervision
0x05DIGOUTStatic digital output
0x06SERIALSerial communication lines
0x07MICROCONTROLLERGeneral microcontroller communication for serial or CAN.

Type classifies some typical types of errors.

NumberError Type
0x###A
0x###BParameter
0x###CCommunication
0x###DTimeout
0x###E
0x###FUnknown

Following tables show the implemented error codes and the corresponding error text, which will be output on “source” on the “error out” cluster:

  • DUT errors:

DUT error codes: 0x2001000C DUT_COMMUNICATION_ERROR, 0x2001000D CAN_COMMUNICATION_TIMEOUT, 0x20010000 CAN_INVALID_SEED_KEY_SEQUENCE, 0x20010001 CAN_WRONG_SEED_KEY, 0x20010002 CAN_INVALID_SET_EOL_SEQUENCE, 0x20010003 CAN_TOOLBOX_DOWNLOAD_FAILED, 0x20010004 CAN_INVALID_RESPONSE_LENGTH, 0x20010101 ISO_TP_FRAME_ERROR, 0x20010102 ISO_TP_UNEXPECTED_RESPONSE_LENGTH, 0x20010103 ISO-TP_RESPONSE_PENDING

  • System errors:

System error codes from 0x1000FFFF UNKNOWN_ERROR_CODE to 0x1007001F UC_OUT_OF_MEMORY

4.6Measurement system API (CORE_API)

A VI library (API) is available to access MesSy by a user application, typically designed in LabVIEW. The library’s functionality will be expanded in future. Because of this, the documentation of the library is available electronically.

The normal command for the CORE API is identical to the flow, described in chapter 5.4.1.

4.6.1Addressing modes for CORE_API

For addressing a specific MesSy the IP-Address of the respective MesSy is used. I.e. every VI of the library has a string input parameter called “IP Address”, which contains the IP-Address in form of a string (e.g. 192.168.101.2 – enter without double quotes)

Note that for every command a slot parameter is passed. The purpose of this parameter is to distinguish between several DUTs on one measurement system. I.e. for DUTs with only little amount of pins and functions, one measurement system can be used to handle up to 6 DUTs in parallel. In this case, when more than one test executions are connecting to the measurement system, the communication routine has to check the connections for every DUT’s test execution. It may not close the connection, until all test executions of all DUTs have closed the connection. Thus, the slot represents the DUT on the measurement system.

4.6.2Functional blocks

Different functional blocks are available in the API. Every VI has a prefix PC_xxx, where xxx is the Block according to the following table:

Functional BlockDescriptionExamples
SYSSystem CommandsGet Timestamp, Establish connection, EEPROM read and write, …
DIGOUTStatic digital output controlSet / Reset single relay, FET, set / reset all relays ,…
PATTERNDynamic digital output control (PWM, Pattern)Set_PWM, Download digital pattern, Start pattern, …
ANALOGAnalog input general controlSet Multiplexer, Get single channel value, Get Waveform of one channel, …
SSVAnalog input signal supervision (SSV)Set supervision configuration, read result since last readout.
CAN / uC_CANCAN communicationConti EOL protocol, ISO-TP (ISO 15765-2), cyclic message transmission.
uC_UARTSerial communicationSerial configuration, send byte, configure serial repeater.
CMMCurrent measurement moduleRead Current Value of one CMM, Set number of CMMs in the chain.
SUBSEQUENCERSubsequencerCreate subsequence, add step, execute subsequence, get step result

4.7Lifetime testing API with labelled channels (TS_API)

A VI library (API) is available to access MesSy by TestStand more comfortable than using the CORE_API. This library is called TS_API. This additional software layer on top of the CORE_API provides the user a more convenient test procedure design, especially when several DUTs have to be tested either with one MesSy or several MesSy’s.

The normal command flow for TS_API is basically the same as in chapter 5.4.1. Differences are the addressing mode of the MesSy by “Bus” and “Slot” number and the signal mapping for addressing the physical analog, digital or communication channel.

The library’s functionality will be expanded in future as will be the CORE_API. Because of this, the documentation of the library is available electronically.

4.7.1Bus, Slot, signal name addressing

The difference of TS_API to the CORE_API is the addressing of the MesSy’s physical channels. While in the CORE_API every physical channel is addressed by the MesSy’s IP-Address and the physical channel number (e.g. 1…96 for single ended analog inputs SE_1to96, Serial_01 … SERIAL_10, 1…24 for FET, ... ), in TS_API there is an addressing via “Bus”, “Slot” and “Signal name”:

  • Bus:
    • Range = [0…255]
    • Is the last number of the IP-Address.
    • The rest of the IP-Address – the IP-address-range - is defined in the signal mapping file (see Signal mapping).
    • E.g.: when Bus = 12, and the IP address range is “192.168.100.”, the addressed MesSy’s IP address will be: “192.168.100.012”,
  • Slot:
    • Range = [1…6]
    • MesSy software is created in that way, that one MesSy can handle up to 6 DUTs.
    • The Slot number represents the DUT number.
    • The Slot selects the appropriate physical channel of one MesSy according to the signal mapping file (see Signal mapping).
  • Signal name
    • Signal name is an arbitrary Name that corresponds to a signal (typically the signal name of the DUT), which is connected either to analog input, digital output or a communication line.
    • The mapping of physical channels to signal names is done in the signal mapping file (see Signal mapping).

E.g. if one MesSy handles three DUTs, the same signal name is present 3 times on one MesSy. The correct physical MesSy channel is selected by the respective Slot number.

4.7.2Signal mapping

In the signal mapping file first of all, the IP address range of all connected MesSy’s is included. The IP address range represents the first three numbers of the IP-addresses (e.g. 192.168.101.).

Furthermore the number of slots, i.e. number of attached DUTs and respective executions is included in this file. And finally the signal mapping from signal names to analog inputs, digital outputs, relays and communication lines for every slot respectively are defined in this file.

The signal mapping file is stored in form of an XML-file. The following XML example shows IP-Address range (common_ip=192.168.101.), number of slots = 2 (count=2) and all possible signal groups.

If a “name” is used more than once, either for the same type (Relay, Single ended input,…) or different types, add the property (as shown in the Analog input example)

resourcesharing = "1"

Otherwise an error will be reported, when the signal mapping file is loaded. This feature may help to avoid unwanted ambiguities.

<?xml version="1.0" encoding="utf-8"?>
<ldsa name="LDSA" count="2" common_ip="192.168.101.">
<modules>
<module name="ANALOG">
   <item name="Example_Signal_Name_Analog_1">
    <connector slot="1" name="SingIn_11" resourcesharing="1"/>
    <connector slot="2" name="SingIn_59" />
   </item>
   <item name="Example_Signal_Name_Analog_2">
    <connector slot="1" name="SingIn_12" />
    <connector slot="2" name="SingIn_60" />
   </item>

   <item name="Example_Signal_Name_Analog_Differential">
    <connector slot="1" name="DiffIn_01a" />
    <connector slot="2" name="DiffIn_09a" />
   </item>
</module>

<module name="RELAY">
   <item name="Relay_VBatt">
    <connector slot="1" name="REL_15" />
    <connector slot="2" name="REL_47" />
   </item>
</module>

<module name="TRIGGER">
   <item name="TRIG1">
    <connector slot="1" name="TRIG_01" />
    <connector slot="2" name="TRIG_04" />
   </item>
</module>

<module name="OPENCOLLECTOR">
   <item name="GREEN">
    <connector slot="1" name="OPEN_COLL_16" />
    <connector slot="2" name="OPEN_COLL_14" />
   </item>
</module>

<module name="FET">
   <item name="PWM_Out">
    <connector slot="1" name="FET_1" />
    <connector slot="2" name="FET_13" />
   </item>
</module>

<module name = "CMM">
  <item name ="CMM">
    <connector slot = "1" name = "CMM_1"/>
    <connector slot = "2" name = "CMM_2"/>
  </item>
</module>

<module name="CAN">
   <item name="COMM_CAN">
     <connector slot="1" name="CAN_1A" />
     <connector slot="2" name="CAN_2A" />
   </item>
   <item name="CAN_Second">
     <connector slot="1" name="CAN_1B" />
     <connector slot="2" name="CAN_2B" />
   </item>
</module>

<module name="SERIAL">
   <item name="K-Line">
     <connector slot="1" name="SERIAL_01" />
     <connector slot="2" name="SERIAL_06" />
   </item>
</module>

<module name="I2C"
  <item name="I2CName">
     <connector slot="1" name="0x42" /> <!-- name is the I2C address without the R/W bit -->
     <connector slot="2" name="0x13" />
  </item>
</module>
</modules>
<itemgroupslist />
</ldsa>

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